Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment

@article{Kuramoto2012LowTemperatureAP,
  title={Low-Temperature and Pressureless Ag–Ag Direct Bonding for Light Emitting Diode Die-Attachment},
  author={Masafumi Kuramoto and Teppei Kunimune and Satoru Ogawa and Masashi Niwa and Keun-Soo Kim and K. Suganuma},
  journal={IEEE Transactions on Components, Packaging and Manufacturing Technology},
  year={2012},
  volume={2},
  pages={548-552}
}
Micrometer-sized Ag particles adsorb substantial oxygen above 200 °C. A dispersion of these particles in alcohol can be successfully used as a die-attach material by sintering the Ag particles to form a soft porous bonding layer. Since the low- temperature sintering of micrometer-sized Ag particles is unlikely to involve the nanometer size effect associated with melting, it was considered that the low-temperature sintering between Ag layers of micrometer thickness would occur in air. The… CONTINUE READING

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