Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators

@article{Candler2006LongTermAA,
  title={Long-Term and Accelerated Life Testing of a Novel Single-Wafer Vacuum Encapsulation for MEMS Resonators},
  author={R. N. Candler and M. Hopcroft and Bongsang Kim and W. Park and Renata Melamud and Manu Agarwal and Gary Yama and Ashton Partridge and Markus Lutz and T. W. Kenny},
  journal={Journal of Microelectromechanical Systems},
  year={2006},
  volume={15},
  pages={1446-1456}
}
We have developed a single-wafer vacuum encapsulation for microelectromechanical systems (MEMS), using a thick (20-mum) polysilicon encapsulation to package micromechanical resonators in a pressure <1 Pa. The encapsulation is robust enough to withstand standard back-end processing steps, such as wafer dicing, die handling, and injection molding of plastic. We have continuously monitored the pressure of encapsulated resonators at ambient temperature for more than 10 000 h and have seen no… CONTINUE READING
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