Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments

Abstract

This paper investigates the impact of isothermal aging on the long-term reliability of lead-free solder joints. The full experimental matrix contains SAC105 and SAC305 solder alloys assembled in ball grid arrays (BGAs) with package sizes ranging from 19mm, 0.8mm pitch to 5mm, 0.4mm pitch, and three surface platings (ImAg, ENIG, and ENEPIG). The test… (More)

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Cite this paper

@inproceedings{Zhao2015LongTA, title={Long Term Aging Effects on the Reliability of Lead Free Solder Joints in Ball Grid Array Packages with Various Pitch Sizes and Ball Alignments}, author={Cong Zhao and Chaobo Shen and Zhou Hai and Jiawei Zhang and M. J. Bozack and J. L. Evans}, year={2015} }