Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction

@article{Li2012LocalizedHA,
  title={Localized heating and bond formation at solder/Cu interface induced by ultrasonic friction},
  author={Zhuolin Li and Mingyu Li and Jongmyung Kim and Hongbae Kim},
  journal={2012 14th International Conference on Electronic Materials and Packaging (EMAP)},
  year={2012},
  pages={1-4}
}
  • Zhuolin Li, Mingyu Li, +1 author Hongbae Kim
  • Published in
    14th International Conference…
    2012
  • Materials Science
  • The intense generation of frictional heat in fast rubbing process can locally melt contacting solids and join materials. This letter decribes a localized heating and soldering at solder/Cu interface induced by ultrasonic friction. Through probing the mean surface temperature of sliding solder bump, the transient nature of frictional heat generation can be deduced, which is associated with the interfacial thermo-mechanical interaction during ultrasonic slip. A thin molten solder film forms at… CONTINUE READING

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