Localization of electrical active defects caused by reliability-related failure mechanism by the application of Lock-in Thermography

@article{Schmidt2013LocalizationOE,
  title={Localization of electrical active defects caused by reliability-related failure mechanism by the application of Lock-in Thermography},
  author={Ch. Schmidt and Kannu Wadhwa and Antoine Reverdy and E. G. J. Reinders},
  journal={2013 IEEE International Reliability Physics Symposium (IRPS)},
  year={2013},
  pages={5B.4.1-5B.4.6}
}
Within this paper, the method of Lock-in Thermography (LIT) is presented and introduced as an useful method for localizing electrical active defects caused by reliability-related failure mechanism. After a short introduction of the physical principle, several case studies are presented.