Lithography aware critical area estimation and yield analysis


Advancing technology nodes have increased the impact of lithography variation on design yield and performance. Although lithographic distortion is emerging as the dominant mode of failure, particulate defect still remains an important source of defect. In this work, we present a novel critical area analysis technique that deals with non-deterministic line… (More)
DOI: 10.1109/TEST.2011.6139152


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