Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and Reliability

Abstract

Micro-ball wafer bumping (MBB) technology, which has capability of fine pitch bumping such as 150-mum pad pitch and the advantages of adjusting the optimum material combinations of joints, was brought into practice. High productivity and yield were achieved by employing an inspection and the repair process with special equipment, and a void-less reflow… (More)

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