Layout Decomposition for Triple Patterning Lithography

@article{Yu2011LayoutDF,
  title={Layout Decomposition for Triple Patterning Lithography},
  author={Bei Yu and Kun Yuan and Boyang Zhang and Duo Ding and David Z. Pan},
  journal={IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems},
  year={2011},
  volume={34},
  pages={433-446}
}
As minimum feature size and pitch spacing further decrease, triple patterning lithography (TPL) is a possible 193nm extension along the paradigm of double patterning lithography (DPL). However, there is very little study on TPL layout decomposition. In this paper, we show that TPL layout decomposition is a more difficult problem than that for DPL. We then propose a general integer linear programming formulation for TPL layout decomposition which can simultaneously minimize conflict and stitch… CONTINUE READING