Laser material processing in microelectronics manufacturing : status and near-term opportunities

@inproceedings{Dunsky2005LaserMP,
  title={Laser material processing in microelectronics manufacturing : status and near-term opportunities},
  author={Corey M. Dunsky},
  year={2005}
}
Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuit boards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processed with lasers. Some of these operations, such as microvia drilling in high-density circuit boards, are well established; others are under evaluation or in early stages of development. This paper summarizes the status of a number of key applications that… CONTINUE READING
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