Laser material processing in microelectronics manufacturing : status and near-term opportunities

  title={Laser material processing in microelectronics manufacturing : status and near-term opportunities},
  author={Corey M. Dunsky},
Lasers continue to gain ground in materials processing applications for microelectronics manufacturing. Printed circuit boards, IC wafers, substrates for blue/green LEDs, and various components in flat panel displays are all being processed with lasers. Some of these operations, such as microvia drilling in high-density circuit boards, are well established; others are under evaluation or in early stages of development. This paper summarizes the status of a number of key applications that… CONTINUE READING
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Publications referenced by this paper.
Showing 1-10 of 15 references

UV Laser Technology to Drive Sub65 nm DRAM Roadmap

  • Y. Sun, P. Kirby
  • 2005

A new era of crystallization : advances in polysilicon crystallization and crystal engineering

  • A. T. Voutsas
  • Applied Surface Science
  • 2004

Advanced Laser Annealing Technology in FPD Industries

  • T. Akashi
  • Proc . CLEO / IQEC & PhAST
  • 2004

Damage - free dicing of lowk wafers

  • P. Subrahmanyan
  • Future Fab . Intl .
  • 2004

Fine Lines in High Yield ( Part CV ) : Laser Direct Imaging Update

  • M. Karnezos
  • 2004

New Laser Marking Technology for Wafers and Chip Scale Packages

  • B. Gu
  • Proc . ICALEO
  • 2004

“ Advance laser tools for display device production on super large substrates

  • P. Rumsby
  • Proc . International Meeting on Information…
  • 2004

Controlled superlateral growth of Si films for microstructural manipulation and optimization

  • J. S. Im
  • Physica Status Solidi
  • 2003

Understanding Moore’s Law,

  • J. Stokes
  • Ars Technica website:…
  • 2003
1 Excerpt

“ Status and future prospects for low k interconnect metrology

  • J. Vittu
  • 2003

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