Laser cleaving method using thermal induced stress for FPD’s and wafer materials

@article{Haupt2006LaserCM,
  title={Laser cleaving method using thermal induced stress for FPD’s and wafer materials},
  author={Olaf Haupt and U. Stute},
  journal={2006 Conference on Lasers and Electro-Optics and 2006 Quantum Electronics and Laser Science Conference},
  year={2006},
  pages={1-1}
}
Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.