LASer De-boNDiNG techNoLoGY For tSV bAcKSiDe proceSSiNG AND thiN

Abstract

Temporary wafer bonding for thin wafer processing is one of the key technologies of 3D system integration. In this context we introduce the polyimide material HD3007 which is suitable for temporary bonding of silicon wafers to carrier wafers by using a thermo compression process. Coating and bonding processes for 200 mm and 150 mm wafers with and without… (More)

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