Kinetics of electroless deposition: the copper-dimethylamine borane system.

  title={Kinetics of electroless deposition: the copper-dimethylamine borane system.},
  author={Daniela Plana and Andrew I Campbell and Samson N. Patole and Galyna Shul and Robert A W Dryfe},
  journal={Langmuir : the ACS journal of surfaces and colloids},
  volume={26 12},
  • Daniela Plana, Andrew I Campbell, +2 authors Robert A W Dryfe
  • Published in
    Langmuir : the ACS journal of…
  • Chemistry, Medicine
  • A kinetic study of the electroless deposition of copper on gold, using dimethylamine borane (DMAB) as a reducing agent, has been carried out. The copper deposition rate in the electroless bath was determined to be 50 nm min(-1), through electrochemical stripping of the copper deposits as well as from direct measurements of the film thickness using atomic force microscopy (AFM). Comparison with a galvanic cell setup, where the two half-reactions were physically separated, yielded a lower… CONTINUE READING

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