Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process

@inproceedings{Li2010KineticsOA,
  title={Kinetics of Ag3Sn growth in Ag–Sn–Ag system during transient liquid phase soldering process},
  author={Jianfeng Li and Pearl A. Agyakwa and Christopher Mark Johnson},
  year={2010}
}
Abstract The kinetics of the interfacial reaction of a thin layer of Sn sandwiched between two pieces of Ag foil has been investigated at temperatures of 260 °C, 300 °C and 340 °C. A time dependence of the form t 1/ n with n  = 3 was obtained for the kinetics of both the consumption of the Sn remaining and the thickening growth of the Ag 3 Sn scallops formed between Sn and Ag. Such a result can be explained well using the model of grain boundary/molten channel-controlled growth of intermetallic… CONTINUE READING

Citations

Publications citing this paper.
SHOWING 1-10 OF 29 CITATIONS

Integrated High Power Modules

  • 2012 7th International Conference on Integrated Power Electronics Systems (CIPS)
  • 2012
VIEW 6 EXCERPTS
CITES BACKGROUND

Preparation and Application of Cu-Ag Composite Preforms for Power Electronic Packaging

  • 2019 IEEE 69th Electronic Components and Technology Conference (ECTC)
  • 2019
VIEW 1 EXCERPT
CITES BACKGROUND

Effect of bonding conditions on shear strength of joints at 200 °C using Sn-coated Cu particle

  • 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition
  • 2017
VIEW 1 EXCERPT
CITES BACKGROUND