Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.

@article{Kim1996KineticAO,
  title={Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening.},
  author={W Kim and T{\'u}},
  journal={Physical review. B, Condensed matter},
  year={1996},
  volume={53 23},
  pages={16027-16034}
}
  • W Kim,
  • Published 1996 in Physical review. B, Condensed matter
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