Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints

A kinetic analysis was formulated for electromigration induced intermetallics evolution of a Cu-Sn diffusion couple. Simulation of the time dependency of intermetallic growth is consistent with experimental data showing growth and accumulation of a high concentration of vacancies and formation of Kirkendall voids at the Cu<sub>6</sub>Sn<sub>5</sub> side of… (More)