Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves

@inproceedings{Chen2019KeyMC,
  title={Key machining characteristics in ultrasonic vibration cutting of single crystal silicon for micro grooves},
  author={Jun-Yun Chen and Tianye Jin and Xichun Luo},
  year={2019}
}
Structured complex silicon components have been widely used in solar cells, biomedical engineering and other industrial applications. As silicon is a typical brittle material, ultrasonic vibration cutting (UVC) is a promising method to achieve better cutting performance than conventional techniques. High-frequency 1D UVC possesses higher nominal cutting speed and material removal rate than many 2D/3D UVC systems, and thus, it has great development potential in industrial applications of… CONTINUE READING