• Engineering
  • Published in
    European Microelectronics and…
    2009

Joint project for mechanical qualification of next generation high density package-on-package (PoP) with through mold via technology

@article{Dreiza2009JointPF,
  title={Joint project for mechanical qualification of next generation high density package-on-package (PoP) with through mold via technology},
  author={Moody Dreiza and Jin Seong Kim and Lee Smith},
  journal={2009 European Microelectronics and Packaging Conference},
  year={2009},
  pages={1-8}
}
This paper will summarize joint work between ST Microelectronics, Amkor Technology and Nokia; to qualify Amkor's through mold via (TMV™) bottom package technology for next generation high density PoP applications. The 12 × 12mm daisy chain test vehicle reported in this joint work includes a thin flip chip die in a fully molded bottom package with 516 bottom BGAs at 0.4mm pitch and 168 top solderable through mold vias at 0.5mm pitch. This paper will report the package level (moisture resistance… CONTINUE READING

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