Isothermal em as highly accelerated test method for copper damascene lines

Wafer level Isothermal (ISOT) test is a highly accelerated test for interconnect electromigration (EM) evaluation, giving benefits of shorter test time and cost savings. Activation energy and physical failure modes of ISOT tests are determined for Copper (Cu) damascene lines. Comparisons are made with long term package level EM test in these aspects… CONTINUE READING