Investigations into packaging technology for membrane-based thermal flow sensors

@inproceedings{Dumstorff2015InvestigationsIP,
  title={Investigations into packaging technology for membrane-based thermal flow sensors},
  author={Gerrit Dumstorff and Eike Brauns and Walter Lang},
  year={2015}
}
A new packaging method to mount a membrane-based thermal flow sensor, flush with the surface, is presented. Therefore, a specific design for the housing is shown, which is also adaptable to other conditions. It has been experimentally shown that it is important to mount the sensor flush with the surface. In addition, the experimental results are discussed. If a membrane-based thermal flow sensor is not mounted flush with the surface, vortices can occur (depending on velocity and fluid… CONTINUE READING

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