Investigation on copper diffusion depth in copper wire bonding

@article{Chen2011InvestigationOC,
  title={Investigation on copper diffusion depth in copper wire bonding},
  author={Catherine H. Chen and Shawn X. Zhang and S. W. Ricky Lee and Lebbai Mohamed},
  journal={Microelectronics Reliability},
  year={2011},
  volume={51},
  pages={166-170}
}
0026-2714/$ see front matter 2010 Elsevier Ltd. A doi:10.1016/j.microrel.2010.09.030 ⇑ Corresponding author. Tel.: +852 23587203; fax: E-mail address: rickylee@ust.hk (S.W. Ricky Lee). Due to the dramatic price increase of precious metals, the replacement of Au with Cu in wire bonding has become an emerging trend for IC packaging nowadays. Similar to the Pb-free soldering transition, such a replacement is not just a simple drop-in material change. Comprehensive processing and reliability… CONTINUE READING
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