Investigation of tier-swapping to improve the thermal profile of memory-on-logic 3DICs

Abstract

In 3DICs heat dissipating devices are stacked directly on top of each other leading to a higher heat density than in a comparable 2D chip. 3D integration also moves the majority of active devices further away from the heatsink. This results in a degraded thermal path which makes it more challenging to remove heat from the active devices. Gradient HeatWave… (More)

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