Investigation of the current resolution limits of advanced extreme ultraviolet (EUV) resists

@inproceedings{Naulleau2006InvestigationOT,
  title={Investigation of the current resolution limits of advanced extreme ultraviolet (EUV) resists},
  author={Patrick P. Naulleau and Clemens Rammeloo and Jason Cain and Kim R. Dean and Paul E. Denham and Kenneth A. Goldberg and Brian Hoef and Bruno M. La Fontaine and Adam Richard Pawloski and Carl E. Larson and Gregory M. Wallraff},
  booktitle={SPIE Advanced Lithography},
  year={2006}
}
The past two years has brought tremendous improvements in the crucial area of resists for extreme ultraviolet (EUV) lithography. Nested and isolated line resolutions approaching 30 nm and 25 nm, respectively, have been demonstrated. These advances have been enabled, in large part, by the high-numerical (0.3) EUV imaging capabilities provided by the Berkeley microfield exposure tool (MET). Here we investigate the resolution limits in several advanced EUV resists using the Berkeley MET… 
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TLDR
Progress is evident in all areas of EUV resist patterning, particularly contact/via and ultrathin resist film performance, and a simplified figure-of-merit approach is described useful for more quantitative assessment of the strengths and weaknesses of current materials.
Application of the Energetiq EQ-10 electrodeless Z-Pinch EUV light source in outgassing and exposure of EUV photoresist
Formulating high sensitivity and high resolution EUV Resists is a critical issue gating the adoption of EUV lithography. The ability of resist manufacturers to quickly screen outgassing rates and
An investigation of EUV lithography defectivity
We have used ASML's full field step-and-scan exposure tool for extreme ultraviolet lithography (EUVL), known as an Alpha Demo Tool, to investigate one of the critical issues identified for EUVL,
Correlation of EUV resist performance metrics in micro-exposure and full-field EUV projection tools
TLDR
The continuing utility of blur-based metrics in guiding resist selection for use in EUV process development and integration at the 22 nm logic node and below is confirmed, providing an exposure-tool independent set of metrics for assessing progress in EUv resist development.
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