Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis

@article{EtessamYazdani2008InvestigationOT,
  title={Investigation of the Impact of Power Granularity on Chip Thermal Modeling Using White Noise Analysis},
  author={Keivan Etessam-Yazdani and Mehdi Asheghi and H. F. Hamann},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2008},
  volume={31},
  pages={211-215}
}
In this paper, we investigate the impact of the granularity of the power distribution for accurately predicting semiconductor chip temperature fields. Specifically, we calculate the transfer functions between power distributions and resulting temperature maps for various microprocessor packages and cooling conditions, which establish a minimum granularity required for accurate thermal analysis. The purpose of this paper is twofold: First, we like to provide some general guidelines for the… CONTINUE READING
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