Investigation of the Dynamics of Liquid Cooling of 3D ICs

@article{Islam2019InvestigationOT,
  title={Investigation of the Dynamics of Liquid Cooling of 3D ICs},
  author={Sakib Islam and Ibrahim Abdel Motaleb},
  journal={2019 8th International Symposium on Next Generation Electronics (ISNE)},
  year={2019},
  pages={1-3}
}
Although 3D IC technology can provide very high integration density, they suffer from having hotspots that may reach 1000’s of degrees. To manage this heat, it is necessary to study the dynamics of cooling and thermal behavior of the ICs. In this study, we report on the dynamics of microchannel liquid cooling using water, R22, and liquid nitrogen. The study shows that using diamond cooling blocks ensures normal operating temperature of 60 ˚C or less, using any of the above coolants. Using SiO2… 

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