Investigation of noise coupling in mixed-signal system-in-packages (SiPs)

Abstract

Noise coupling in mixed-signal system-in-packages (SiPs) has been investigated experimentally. Four BGA types of mixed-signal SiPs consisting of a sound source LSI chip (victim) and a speaker amplifier LSI chip (aggressor) have been designed and fabricated for investigating noise coupling from a Class-D amplifier and a DC-DC converter of the speaker LSI to… (More)

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Cite this paper

@article{Sasaki2011InvestigationON, title={Investigation of noise coupling in mixed-signal system-in-packages (SiPs)}, author={Hideki Sasaki and Tatsuaki Tsukuda and Yuki Fujimura and Tomoo Murakami and Hiroyuki Terai}, journal={2011 8th Workshop on Electromagnetic Compatibility of Integrated Circuits}, year={2011}, pages={194-197} }