Investigation of adhesive bonding on non-noble metal in Electronic Packaging

@article{Paproth2010InvestigationOA,
  title={Investigation of adhesive bonding on non-noble metal in Electronic Packaging},
  author={Angelika Paproth and Benjamin Adolphi and K.-J. Wolter},
  journal={3rd Electronics System Integration Technology Conference ESTC},
  year={2010},
  pages={1-6}
}
Electrical conductive bonding for certain application is more and more an interesting alternative to soldering in Electronic Packaging. Noble surfaces like gold, silver, palladium and silver-filled polymer-based adhesives are state of the art in such bonding. 

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