Investigation of Interfacial Layer for Ultrasonic Spot Welded Aluminum to Copper Joints

Abstract

The bonding formation for ultrasonic welding of dissimilar metals has been shrouded in mystery because of the complex thermomechanical behavior at the bonding interface. We investigated the microstructure and phases at the bonding interface of ultrasonically welded aluminum to copper joints using transmission electron microscopy, and found a ~10 nm thick… (More)
DOI: 10.1038/s41598-017-12164-2

Topics

5 Figures and Tables

Slides referencing similar topics