Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration

Abstract

The introduction and use of ultra low-k dielectric materials in an attempt to achieve better die performance brought new challenges to the wafer singulation / dicing process. Ultra low-k dielectric materials can easily get damaged during conventional blade dicing due to their brittleness. Thus, there is a need to investigate alternative or more advanced… (More)

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Cite this paper

@article{Podpod2016InvestigationOA, title={Investigation of Advanced Dicing Technologies for Ultra Low-k and 3D Integration}, author={Arnita Podpod and Fumihiro Inoue and Ingrid de Wolf and M. Gonzalez and M. K. Rebibis and R. A. Miller and E. Beyne}, journal={2016 IEEE 66th Electronic Components and Technology Conference (ECTC)}, year={2016}, pages={1247-1258} }