Introduction to Fine Copper Wire Development

  title={Introduction to Fine Copper Wire Development},
  author={Q. H. Pan and H. B. Tan and W. P. Yang and X. Z. Dai and H. Anderson and John K.-H. Quah},
  journal={2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium},
The article presents the fine 20 um (0.8 mil diameter) copper wire bonding development using SOT package as the test vehicle. The project scope covered fine copper wire bonding process capability study; reliability tests and electrical characterization; Cu-AI intermetallic compound (IMC) characterization and large scale manufacturability evaluation. 


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Publications referenced by this paper.

Introduction of Copper Wire Bonds to Automotive Package, I1h Annual Automotive Electronics Council Workshop

Harold Anderson
IEMT • 2006

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