Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection

  title={Intrinsic time resolution of 3D-trench silicon pixels for charged particle detection},
  author={Lucio Anderlini and Mauro Aresti and Andrea Bizzeti and Maurizio Boscardin and Alessandro Cardini and G. F. Dalla Betta and M. Ferrero and G. T. Forcolin and Michela Garau and Adriano Lai and Andrea Lampis and Angelo Loi and Chiara Lucarelli and Roberto Mendicino and R. Mulargia and M. M. Obertino and Enrico Robutti and Sabina Ronchin and Marta Ruspa and Stefania Vecchi},
  journal={Journal of Instrumentation},
  pages={P09029 - P09029}
In the last years, high-resolution time tagging has emerged as a promising tool to tackle the problem of high-track density in the detectors of the next generation of experiments at particle colliders. Time resolutions below 50 ps and event average repetition rates of tens of MHz on sensor pixels having a pitch of 50 μm are typical minimum requirements. This poses an important scientific and technological challenge on the development of particle sensors and processing electronics. The TIMESPOT… 

Timing performances of front-end electronics with 3D-trench silicon sensors

: Detectors based on pixels with timing capabilities are gaining increasing importance in the last years. Next-to-come high-energy physics experiments at colliders require the use of time information

Front-end Electronics for Timing with pico-second precision using 3D Trench Silicon Sensors

The next generation of collider experiments require tracking detectors with extreme performance capabilities in terms of spatial resolution (tens of µm), radiation hardness (1017 1 MeV neq/cm2) and

Accurate modelling of 3D-trench silicon sensor with enhanced timing performance and comparison with test beam measurements

This paper presents the detailed simulation of a double-pixel structure for charged particle detection based on the 3D-trench silicon sensor developed for the TIMESPOT project and a comparison of the

Timing optimisation and analysis in the design of 3D silicon sensors: the TCoDe simulator

The development, performance and use of the TCoDe simulator, specifically dedicated to the fast simulation of carrier transportation phenomena in solid state sensors, are illustrated.

A Modified 3D-Trench Pixel Detector: Proof of Concept by TCAD Simulations

A design modification to an existing 3D-trenched pixel detector is proposed, aimed at an improved fabrication yield. The device concept is studied and its performance is evaluated by TCAD

Charged-particle timing with 10 ps accuracy using TimeSPOT 3D trench-type silicon pixels

For the next generation of vertex detectors, the accurate measurement of the charged particle timing at the pixel level is considered to be the ultimate solution in experiments operating at very high

Advances in 3D Sensor Technology by Using Stepper Lithography

3D pixel sensors aimed at the upgrades of the ATLAS and CMS experiments at the High Luminosity LHC have small pixel size and pretty dense layouts. In addition, modified 3D designs with small pixel

Fabrication and Characterisation of 3D Diamond Pixel Detectors With Timing Capabilities

Diamond sensors provide a promising radiation hard solution to the challenges posed by the future experiments at hadron machines. A 3D geometry with thin columnar resistive electrodes orthogonal to

10 ps timing with highly irradiated 3D trench silicon pixel sensors

In this paper the results of a beam test characterization campaign of 3D trench silicon pixel sensors are presented. A time resolution in the order of 10 ps was measured both for non-irradiated and

Timespot1: a 28 nm CMOS Pixel Read-Out ASIC for 4D Tracking at High Rates

We present the first characterization results of Timespot1, an ASIC designed in CMOS 28 nm technology, featuring a 32 × 32 pixel matrix with a pitch of 35 μm. Timespot1 is the first small-size



A High-Granularity Timing Detector for the ATLAS Phase-II upgrade

  • A. Aboulhorma
  • Physics
    Proceedings of The Ninth Annual Conference on Large Hadron Collider Physics — PoS(LHCP2021)
  • 2021
The High Luminosity Large Hadron Collider is scheduled to begin in 2027 where faster and more radiation hard detectors are needed to cope with higher track multiplicity and higher radiation levels.

A MIP Timing Detector for the CMS Phase-2 Upgrade

  • Tech. Rep. CERN-LHCC-2019-003 CMS-TDR-020,
  • 2019

A MIP Timing Detector for the CMS Phase-2 Upgrade. Technical Design Report

  • CERN-LHCC-2019-003, CMS-TDR-020, 2019.
  • 2019

High-Luminosity Large Hadron Collider (HL-LHC) : Preliminary Design Report

The present document describes the technologies and components that will be used to realise the High Luminosity LHC and is intended to serve as the basis for the detailed engineering design of HL-LHC.

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The PPS (Precision Proton Spectrometer) system consists of tracking and timing detectors installed along the LHC beam line between 210 and 220 m from the interaction point on both sides of the CMS

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In response to the 2013 Update of the European Strategy for Particle Physics (EPPSU), the Future Circular Collider (FCC) study was launched as a world-wide international collaboration hosted by CERN.

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The high luminosities expected at collider experiments over the coming years will put stringent requirements on the vertex detectors used in these experiments. The increased pile up will require

FCC Physics Opportunities

We review the physics opportunities of the Future Circular Collider, covering its e+e-, pp, ep and heavy ion programmes. We describe the measurement capabilities of each FCC component, addressing the

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Abstract In response to the 2013 Update of the European Strategy for Particle Physics, the Future Circular Collider (FCC) study was launched, as an international collaboration hosted by CERN. This