Intermetallic growth studies on SAC/ENIG and SAC/Cu-OSP lead-free solder joints

Lead-free solder joint reliability in electronic packaging assemblies is a concern when the product is subject to thermal exposure. The intermetallic compound (IMC) growth in Sn3.8Ag0.7Cu(SAC)/ENIG and SAC/Cu-OSP solder joint at different thermal aging condition were reported in this study. The IMC growth behavior subjected to isothermal aging exposure at… CONTINUE READING