Interfacial stress in Through Silicon Vias

  • Li Wei, Qin Fei, +5 authors Wang Jun
  • Published 2012 in
    2012 13th International Conference on Electronic…

Abstract

Through Silicon Via (TSV) has emerged as a good solution to provide high density interconnections in three-dimensional packaging interconnect technologies. However, the thermal-mechanical reliability is a big issue. When the TSV is subjected to thermal load, large stress and strain would be created at the interface of the materials because of the great… (More)

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