Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate

@inproceedings{Lee2005InterfacialRA,
  title={Interfacial reactions and joint reliability of Sn-9Zn solder on Cu or electrolytic Au/Ni/Cu BGA substrate},
  author={Chang-Yong Lee and Jeong-Won Yoon and Yong-Jin Kim and Seung-Boo Jung},
  year={2005}
}
The interfacial reactions and shear strength of joints between Sn-9Zn solder and two different kinds of BGA (ball-grid-array) substrates (Cu and Au/Ni-P/Cu) were investigated for reflow conditions of 230^oC up to 60min. For the Cu substrate, only Cu"5Zn"8 intermetallic compound was observed and other Cu-Sn IMCs were not observed. For the Au/Ni/Cu substrate, an AuZn"3 IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, some of the AuZn"3 IMC layer was… CONTINUE READING

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