Interfacial Characterization and Bonding Mechanism of Ultrasonic Wedge Bonding

The joining mechanism of ultrasonic wedge bonding was investigated by chemical etching method. Compared to peeling-off method, the advantage of chemical etching method not only reflected the characters of the bond interface, but also indicated the physical process and bonding mechanism of the interconnection between the metal wire and metallization. It was… CONTINUE READING