Interconnection and double layer for flexible electronic circuit with instant inkjet circuits

Abstract

Instant Inkjet Circuits by silver nano-particle ink realized home-brew electric circuit fabrication. However, current method can support only single-layered patterns, and conventional inter-layer connection methods are not suitable. In this paper, we will evaluate various easy-to-use inter-layer connection methods by making via holes, especially the ones… (More)
DOI: 10.1145/2750858.2804276

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