Interconnect Electromagnetic Modeling using Conduction Modes as Global Basis Functions

@inproceedings{Daniel2000InterconnectEM,
  title={Interconnect Electromagnetic Modeling using Conduction Modes as Global Basis Functions},
  author={Luca Daniel and Alberto Sangiovanni-Vincentelli and J. White},
  year={2000}
}
A new method is formulated for modeling current distributions inside conductors for a quasi-static or a full-wave electromagnetic field simulator. In our method, we model current distributions inside interconnects using a small number of conduction modes as global basis functions for the discretization of the Mixed Potential Integral Equation. A very simple example is presented to illustrate the potential of our method. 

From This Paper

Topics from this paper.

Citations

Publications citing this paper.
Showing 1-10 of 11 extracted citations

CAPLET: A Highly Parallelized Field Solver for Capacitance Extraction Using Instantiable Basis Functions

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems • 2016

Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems

2011 IEEE International Symposium on Electromagnetic Compatibility • 2011
View 1 Excerpt

Skin-effect model for time and frequency domain PEEC solver

2011 IEEE International Symposium on Electromagnetic Compatibility • 2011
View 1 Excerpt

Efficient capacitance solver for 3D interconnect based on template-instantiated basis functions

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems • 2009

Partitioned conduction modes in surface integral equation-based impedance extraction

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) • 2003

References

Publications referenced by this paper.
Showing 1-10 of 14 references

A wide frequency range surface integral formulation for 3-D RLC extraction

1999 IEEE/ACM International Conference on Computer-Aided Design. Digest of Technical Papers (Cat. No.99CH37051) • 1999
View 1 Excerpt

Coordinate-transformed arnoldi algorithm for generating guarantee stable reduced-order models of rlc

L. M. Silveira, I Elfadel, M. Kamon, J. White
Special Issue on Advances of Comp. Methods in Electromagnetics, • 1999
View 1 Excerpt

Enhanced skin effect for partial element equivalent circuit (peec) models

K. M. Coperich, A. E. Ruehli, A. C. Cangellaris
In IEEE Topical Meeting on Electrical Performance of Electronic Packaging, • 1999
View 1 Excerpt

PRIMA: passive reduced-order interconnect macromodeling algorithm

IEEE Trans. on CAD of Integrated Circuits and Systems • 1998
View 1 Excerpt

Interconnect series impedance determination using a surface ribbon method

E. Tuncer, B. T. Lee, D. P. Neikirk
IEEE Topical Meeting on Electrical Performance of Electronic Packaging, • 1994
View 1 Excerpt

Similar Papers

Loading similar papers…