Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits

  title={Interconnect-Based Design Methodologies for Three-Dimensional Integrated Circuits},
  author={Vasilis F. Pavlidis and Eby G. Friedman},
  journal={Proceedings of the IEEE},
Design techniques for three-dimensional (3-D) ICs considerably lag the significant strides achieved in 3-D manufacturing technologies. Advanced design methodologies for two-dimensional circuits are not sufficient to manage the added complexity caused by the third dimension. Consequently, design methodologies that efficiently handle the added complexity and inherent heterogeneity of 3-D circuits are necessary. These 3-D design methodologies should support robust and reliable 3-D circuits while… CONTINUE READING
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