Interaction, transformation and toxicity assessment of particles and additives used in the semiconducting industry.


Chemical mechanical planarization (CMP) is a widely used technique for the manufacturing of integrated circuit chips in the semiconductor industry. The process generates large amounts of waste containing engineered particles, chemical additives, and chemo-mechanically removed compounds. The environmental and health effects associated with the release of CMP… (More)
DOI: 10.1016/j.chemosphere.2017.10.138