Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)

@article{Wang2010IntegratedMO,
  title={Integrated magnetics on silicon for power supply in package (PSiP) and power supply on chip (PwrSoC)},
  author={Ningning Wang and Jason Hannon and R. F. Foley and Kevin G. McCarthy and Terence O'Donnell and Kenneth W Rodgers and Finbarr Waldron and Cian O Mathuna},
  journal={3rd Electronics System Integration Technology Conference ESTC},
  year={2010},
  pages={1-6}
}
The paper introduces the context for the emerging area of integrated power conversion. The key applications driving this trend are outlined and the principal competing technologies are presented encompassing system in package, system on chip and embedded substrate solutions. A system-in-package, 30MHz dc-dc converter using a stacked co-packaging approach is demonstrated. Its enabling key elements, including magnetics on Si technology, a power IC with a digital pulse width modulator and on-chip… CONTINUE READING

Citations

Publications citing this paper.
Showing 1-7 of 7 extracted citations

Similar Papers

Loading similar papers…