Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips

@article{Dang2010IntegratedMC,
  title={Integrated Microfluidic Cooling and Interconnects for 2D and 3D Chips},
  author={Bing Dang and M. S. Bakir and D. C. Sekar and C. R. King and J. Meindl},
  journal={IEEE Transactions on Advanced Packaging},
  year={2010},
  volume={33},
  pages={79-87}
}
Power dissipation in microprocessors is projected to reach a level that may necessitate chip-level liquid cooling in the near future. An on-chip microchannel heat sink can reduce the total thermal interfaces between an integrated circuit chip and the convective cooling medium and therefore yield smaller junction-to-ambient thermal resistance. This paper reports the fabrication, assembly, and testing of a silicon chip with complementary metal-oxide-semiconductor process compatible microchannel… CONTINUE READING

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