Integrated Copper Heat Slugs and EMI Shields in Panel Laminate (LFO) and Glass Fanout (GFO) Packages for High Power RF ICs


This paper demonstrates, for the first time, ultra-thin, panel laminate fan-out (LFO) and glass fan-out (GFO) packages with embedded copper heat spreaders and electromagnetic shields for packaging high-power RF ICs in much smaller form factors and at potentially much lower cost than current ceramic and metal flange packages. This unique double-sided package… (More)


12 Figures and Tables