Insights into correlation between board-level drop reliability and package-level ball impact test

@article{Yeh2006InsightsIC,
  title={Insights into correlation between board-level drop reliability and package-level ball impact test},
  author={Chang-Lin Yeh and Yi-Shao Lai},
  journal={56th Electronic Components and Technology Conference 2006},
  year={2006},
  pages={7 pp.-}
}
The ball impact test is developed as a package-level measure for the board-level drop reliability of solder joints in the sense that it leads to fracturing of solder joints around the intermetallics, similar to that from a board-level drop test. In this paper, both board-level drop test and package-level ball impact test are examined numerically for solder joints of different Sn-Ag-Cu compositions. Correlations between the drop reliability and characteristics of the impact force profile are… CONTINUE READING
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