Innovative wafer-level encapsulation & underfill material for silicon interposer application

@article{Ferrandon2013InnovativeWE,
  title={Innovative wafer-level encapsulation & underfill material for silicon interposer application},
  author={C. Ferrandon and Amandine Jouve and Sylvain Joblot and Yann Lamy and Arnaud Schreiner and Pierre Montmeat and Michel Pellat and M. Argoud and F. Fournel and Gilles Simon and S{\'e}verine Cheramy},
  journal={2013 IEEE 63rd Electronic Components and Technology Conference},
  year={2013},
  pages={761-767}
}
This paper is dedicated to the full integration of a new silicone-based material for Molding-Underfilling (MUF) on silicon interposer wafers containing Through Silicon Vias (TSVs) and top dice. The developments were carried out in the frame of “silicon package” where the silicon interposer is either reported on P-BGA or directly assembled on board. After a materials screening with regard to warpage issue, “molding last” was studied with the selected material, including compatibility with… CONTINUE READING

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