Inner lead bonding for a resin molded chip size package

  title={Inner lead bonding for a resin molded chip size package},
  author={Megumu Nagasawa and S. Tanagawa and Nobuhiko Yoshio and Kazumasa Igarashi and H. Yada},
  journal={Nineteenth IEEE/CPMT International Electronics Manufacturing Technology Symposium},
The present study investigated methods for bonding between semiconductor bonding pads and the metal bumps of a film carrier developed for use in chip-size packages (CSP). The structure of the film carrier is that of a copper circuit bearing a layer of insulating polyimide (PI) on both sides and connecting on one side with the exposed bumps, which in turn connect with the bonding pads. The bumps either have a copper core with a gold surface, or are all gold. In the first stage of the experiment… CONTINUE READING

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