Influences of bonding parameters on the tool wear for copper wire bonding

  title={Influences of bonding parameters on the tool wear for copper wire bonding},
  author={Paul Eichwald and Walter Sextro and Simon Althoff and Florian Eacock and Mark Schnietz and Karsten Guth and Michael Brox0308kelmann},
  journal={2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)},
Ultrasonic wire bonding is a common technology for manufacturing electrical interconnects. In the field of power electronics, new thermal and electrical obligations arose due to increasing power density requirements. One approach to achieve these aims is replacing the wire material for heavy wire bonds from aluminum to copper. This material change leads to challenging tasks and problems, for instance the occurring wear of the bond tool. The wear is significantly higher using copper wire instead… CONTINUE READING


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