Influences of bonding parameters on the tool wear for copper wire bonding

@article{Eichwald2013InfluencesOB,
  title={Influences of bonding parameters on the tool wear for copper wire bonding},
  author={Paul Eichwald and Walter Sextro and Simon Althoff and Florian Eacock and Mark Schnietz and Karsten Guth and Michael Brox0308kelmann},
  journal={2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)},
  year={2013},
  pages={669-672}
}
Ultrasonic wire bonding is a common technology for manufacturing electrical interconnects. In the field of power electronics, new thermal and electrical obligations arose due to increasing power density requirements. One approach to achieve these aims is replacing the wire material for heavy wire bonds from aluminum to copper. This material change leads to challenging tasks and problems, for instance the occurring wear of the bond tool. The wear is significantly higher using copper wire instead… CONTINUE READING

Citations

Publications citing this paper.
Showing 1-4 of 4 extracted citations

Heavy copper wire bonding ready for industrial mass production

2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM) • 2016
View 4 Excerpts
Highly Influenced

Aluminum–Copper Ribbon Interconnects for Power Devices

IEEE Transactions on Components, Packaging and Manufacturing Technology • 2017
View 1 Excerpt

Effect of Different Oxide Layers on the Ultrasonic Copper Wire Bond Process

2016 IEEE 66th Electronic Components and Technology Conference (ECTC) • 2016

Bond tool life improvement for large copper wire bonding

2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) • 2015
View 1 Excerpt

Similar Papers

Loading similar papers…