Influence of polonium diffusion at elevated temperature on the alpha emission rate and memory SER performance

Abstract

Alpha emission rate measurements were performed on solder bump material at room temperature and post bake at high temperature. Results indicate an increase in alpha emission rate after high temperature bake process attributable to Po-210 out-diffusion from such solder bumps. Real-time system-level soft error rate (SER) measurements show >60% higher… (More)

Topics

11 Figures and Tables

Cite this paper

@article{Narasimham2017InfluenceOP, title={Influence of polonium diffusion at elevated temperature on the alpha emission rate and memory SER performance}, author={Balaji Narasimham and Ennis T. Ogawa and J. K. Wang and Saket Gupta and Dan Reed and Bhaswar Mitra and Henry Luk and Xiaofeng Zhang and Joyce Yeung and Hsin-Yuan Ho and Jeff Dull}, journal={2017 IEEE International Reliability Physics Symposium (IRPS)}, year={2017}, pages={3D-4.1-3D-4.8} }