Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach☆

@inproceedings{Aziz2013InfluenceOP,
  title={Influence of pin offset in PCB through-hole during wave soldering process: CFD modeling approach☆},
  author={Mohd Sharizal Abdul Aziz and Mohd Zulkifly Abdullah and C. Y. Khor and F. Che Ani},
  year={2013}
}
Abstract This paper presents the three-dimensional finite-volume-based simulation of the effects of pin through-hole (PTH) offset position in a wave soldering process. The PTH model was built and meshed by using GAMBIT software and tetrahedral/hybrid elements. In the wave soldering process, the advancement of molten solder was tracked by using Volume of Fluid technique. FLUENT software was employed to analyze the filling of molten solder (63Sn37Pb) and the capillary action between printed… CONTINUE READING

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