Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition

@inproceedings{Imaz2009InfluenceOA,
  title={Influence of additives and plating parameters on morphology and mechanical properties of copper coatings obtained by pulse electrodeposition},
  author={Nagore Imaz and Eva Garc{\'i}a-Lecina and Catalina Su{\'a}rez and Javier A. Diez and Jean-Baptiste Rodriguez and Joel Molina and Victor Garc{\'i}a-Navas},
  year={2009}
}
Abstract In this study, the influence of additives (Cl−, thiourea and gelatine) and pulse plating parameters on the structure and properties of copper coatings obtained through an acid copper plating bath was studied. In order to determine the properties of deposited layers, a microhardness tester was used for microhardness measurement, X-ray diffraction for microstructural analysis, and a scanning electron microscope equipped with an electron backscatter diffraction module for determining… CONTINUE READING

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