Industry Drop Tests in Solder Joint Reliability Study of Molded Flip Chip Package

@article{Ong2006IndustryDT,
  title={Industry Drop Tests in Solder Joint Reliability Study of Molded Flip Chip Package},
  author={Kang Eu Ong and Wei Kea Loh and Chee Wai Wong and Y. S. Yip and Choi Keng Chan and S. A. Lim and Seok Ling Lee and Shankar Ganapathysubramanian},
  journal={2006 International Conference on Electronic Materials and Packaging},
  year={2006},
  pages={1-7}
}
In this paper, the author has compared the package performance of molded flip chip package in two types of industry drop test conditions namely test J and N. Drop dynamic analysis, failure mechanism and board design options were discussed in detail. High speed camera (HSC) and strain measurement analyses were used in this study. It was found that the molded package has a shorter life span when tested using drop test J as compared to drop test N; even though test N has a higher shock pulse than… CONTINUE READING

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