Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation

@article{Pufall2012IncreasingTR,
  title={Increasing the robustness for reliable packages by prediction of delamination by cohesive zone element simulation},
  author={Reinhard Pufall and Michael Goroll and Werner Kanert and Rainer Dudek},
  journal={2012 13th International Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems},
  year={2012},
  pages={1/4-4/4}
}
Robustness of a package is often proven by performing temperature cycling tests. Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remains a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to a certain number of cycles… CONTINUE READING